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Home›All-in Cost›In-Mold Electronics: Short-Term Pain, Long-Term Gain?

In-Mold Electronics: Short-Term Pain, Long-Term Gain?

By Roy George
November 4, 2021
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Electronics in the Mold (IME) is often touted as the next revolution in the manufacturing of automotive touch interfaces. However, while smooth capacitive touch sensors are increasingly common in many recently released vehicles, especially on steering wheels and center console parts, they are not currently produced by IME. Instead, other methods such as applying functional films to existing 3D parts are used.

This apparent discrepancy poses an important question: will the capacitive human-machine interface (HMI) components of the future be produced using IME, or will the simpler manufacturing methodologies currently in use persist?

HMI components that provide backlit capacitive touch sensing are increasingly used in multiple applications, including automotive interiors and appliance control panels. Compared to traditional mechanical switches, the reduced number of parts used in backlit capacitive touch sensors make them both lighter and easier to assemble, while the lack of inconspicuous buttons means they can be cleaned.

Despite their visual similarity, backlit capacitive touch sensors can be produced with a wide range of different methods. A common approach, deployed in some recently launched cars, is to first produce a decorative, often curved, part via high pressure thermoforming and subsequent injection molding. A functional film comprising a printed conductive pattern of capacitive switches and interconnects is then affixed to the back side. Conductive regions can be transparent (either via a PEDOT: PSS conductive polymer or wire mesh) to allow backlighting with separately produced waveguides.

In contrast, the IME manufacturing process places more stringent demands on the materials. First, a conductive ink is printed on a plastic substrate, usually polycarbonate. Electrically Conductive Adhesives (ECA) are then used to attach electrical components such as LEDs. The substrate with conductive traces and mounted components is then thermoformed to produce the desired curvature, followed by injection molding to produce the complete part.

Due to the less stringent hardware requirements and lower adoption barriers compared to IME, the application of functional foils to gently curved parts to make capacitive touch switches has already reached commercialization in the automotive industry. Since both manufacturing methods result in parts with very similar functionality and therefore customer experience, how can IME compete?

The answer lies in taking into account the parts and assembly processes that the IME makes unnecessary. For example, providing capacitive touch sensing by applying functional foils means that the lighting and therefore the waveguides have to be produced and installed separately, whereas with IME they are an integral part of the component. This greater integration means that the IME will reduce the number of parts / materials and overall reduce assembly processes. The IME parts will therefore be lighter, benefiting both the range and the durability of electric vehicles.

Crucially, as IME technology develops, a wider range of features will be incorporated. These include haptics, energy harvesting, heating, and even control electronics (i.e. PCBs), eliminating the need for many separate parts and thus improving the value proposition. of EMIs versus competing manufacturing methods. With functional sheets such extensive electronics integration is difficult and slow because the components would have to be mounted on a 3D surface – in contrast, with IME, the electronic components can be mounted prior to thermoforming via a pick-and-place. Relatively fast conventional 2D.

In summary, commercial adoption of IME is currently lagging behind some of the alternative methods for producing capacitive touch surfaces. However, IME offers much greater potential for the integration of additional electronic functionality, allowing components that are smaller, lighter and easier to produce, leading to a lower overall cost (see graph). As such, IDTechEx believes its comparative advantage over methods such as the application of functional sheets will increase over time, leading to widespread adoption.

This article is based on the recently published IDTechEx report “In-Mold Electronics 2022-2032: Technology, Market Forecasts, Players” which covers both IME and competing technologies for the production of decorative capacitive interfaces. It discusses manufacturing methodologies, material requirements, applications and challenges in great detail. A 10-year market forecast by application sector, expressed in both revenue and IME panel area, is provided along with associated material opportunities. Also included are several sample application prototypes, a lifecycle analysis of typical IME components, and several company profiles based on interviews with start-ups and established companies. Further details and sample downloadable pages are available at www.IDTechEx.com/IME.

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